JPH0342701B2 - - Google Patents

Info

Publication number
JPH0342701B2
JPH0342701B2 JP60231702A JP23170285A JPH0342701B2 JP H0342701 B2 JPH0342701 B2 JP H0342701B2 JP 60231702 A JP60231702 A JP 60231702A JP 23170285 A JP23170285 A JP 23170285A JP H0342701 B2 JPH0342701 B2 JP H0342701B2
Authority
JP
Japan
Prior art keywords
electrode plate
hollow insulator
semiconductor device
semiconductor element
elastic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60231702A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6290951A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP60231702A priority Critical patent/JPS6290951A/ja
Publication of JPS6290951A publication Critical patent/JPS6290951A/ja
Publication of JPH0342701B2 publication Critical patent/JPH0342701B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
JP60231702A 1985-10-16 1985-10-16 半導体装置 Granted JPS6290951A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60231702A JPS6290951A (ja) 1985-10-16 1985-10-16 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60231702A JPS6290951A (ja) 1985-10-16 1985-10-16 半導体装置

Publications (2)

Publication Number Publication Date
JPS6290951A JPS6290951A (ja) 1987-04-25
JPH0342701B2 true JPH0342701B2 (en]) 1991-06-28

Family

ID=16927660

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60231702A Granted JPS6290951A (ja) 1985-10-16 1985-10-16 半導体装置

Country Status (1)

Country Link
JP (1) JPS6290951A (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5040234B2 (ja) 2006-09-26 2012-10-03 三菱電機株式会社 圧接型半導体装置

Also Published As

Publication number Publication date
JPS6290951A (ja) 1987-04-25

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